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Lam Research Corporation Announces $25 Billion Share Repurchase Authorization and Declares Quarterly Dividend

Lam Research Corporation (Nasdaq: LRCX) today announced that its Board of Directors approved a $25 billion share repurchase ...
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Celebrating 40 Years of Innovation: Lam Honored by the State of Carinthia in Austria

The Carinthian Coat of Arms celebrates Lam Research’s lasting impact on innovation, talent development, economic growth, and semiconductor technology, both in Austria and around the world.
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Glass Substrates Open the Window to Advancing AI Chip Packaging

Glass substrates offer mechanical, electrical, and chemical advantages for AI and HPC chips Industrywide adoption first requires resolving manufacturing and standardization issues Lam is helping scale ...
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How Virtual Twins and Machine Learning Optimize DRAM Yield

Virtual twins and machine learning (ML) offer a faster, lower-cost way to identify systemic yield issues as DRAM manufacturing grows more complex.
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Lam and imec Expand Collaboration to Advance Manufacturability of Next-Gen 3D Integration Technologies, Explore Aether Dry Resist Use Cases

AI computing is driving demand for advanced packaging and 3D integration. Lam and imec are expanding joint R&D to accelerate manufacturing readiness. The collaboration now includes Aether® dry resist ...
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Lam Research Corporation Reports Financial Results for the Quarter Ended September 27, 2026

Lam Research Corporation (the "Company," "Lam," "Lam Research") today announced financial results for the quarter ended September 27, 2026 (the "September 2026 quarter"). Highlights for ...